High-temp. inner Ag conductive paste
PRODUCT DESCRIPTION
High-temperature sintered silver paste combined with printing and forming processing technology, and then co-fired by high-temperature ceramics to made into chip components.
Silver paste provides suitable ceramic co-firing ability and maintains excellent electrical properties. Through the development of formula technology to provides a widely ceramic co-firing and finer line printing capability.
MAIN FEATURE
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Stable electrical performance.
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Excellent high temperature reliability.
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Fine line printing corresponding ability.
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Lower shrinkage at Higher temperature enhance product stability.
SPECIFICATION & APPLICATION
Standard type：Applicable to wet and dry process, good for printed line width ≥ 80um
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Product Name
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Solid Content
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Viscosity
10 rpm
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Fineness
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Volume resistivity
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| IP3190 | 90±1% | 210±20% | ≤15um | <3E-6Ω·cm |
| IP3185 | 85±1% | 210±20% | ≤15um | <3E-6Ω·cm |
| IP3180 | 80±1% | 210±20% | ≤15um | <3E-6Ω·cm |
Low Shrinkage type：Applicable to wet and dry process, good for silver coating thickness ≥ 30u
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Product Name
|
Solid Content
|
Viscosity
10 rpm
|
Fineness
|
Volume resistivity
|
| IP3190-AZ | 90±1% | 210±20% | ≤15um | <3E-6Ω·cm |
| IP3185-AZ | 85±1% | 150±20% | ≤15um | <3E-6Ω·cm |
| IP3180-AZ | 80±1% | 50±10% | ≤15um | <3E-6Ω·cm |
For Fine Line type：Applicable to wet and dry process, good for printed circuit from 40 to 80um
|
Product Name
|
Solid Content
|
Viscosity
10 rpm
|
Fineness
|
Volume resistivity
|
| IP3190 | 90±1% | 210±20% | ≤15um | <3E-6Ω·cm |
| IP3185 | 85±1% | 210±20% | ≤15um | <3E-6Ω·cm |
| IP3180 | 80±1% | 210±20% | ≤15um | <3E-6Ω·cm |
Storage and Shelf Life
Store in a cool(temperature below than 25℃ is recommended), dry and well-ventilated area.