Paste

 

 

  • 半導體封裝

  • Conductive Silver Paste for LED package and IC package
  • Product Number
    Characteristics
    Applications
    Metal
    Application method
    Curing
    condition

    AI-8400

    Excellent adhesive strength
    IC package
    Ag
    Dispensing
    185℃x30min(oven) or 200℃x3min(Hot plate)
    AI-8500
    Excellent adhesive strength
    IC package
    Ag
    Dispensing
    175℃x60min(oven) or 200℃x3min(Hot plate)

    EP9120

    Excellent adhesive strength
    LED package
    Ag
    Dispensing
    150℃x60min