High-temp. inner Ag conductive paste

PRODUCT DESCRIPTION

High-temperature sintered silver paste combined with printing and forming processing technology, and then co-fired by high-temperature ceramics to made into chip components.

Silver paste provides suitable ceramic co-firing ability and maintains excellent electrical properties. Through the development of formula technology to provides a widely ceramic co-firing and finer line printing capability.

MAIN FEATURE

  • Stable electrical performance.

  • Excellent high temperature reliability.

  • Fine line printing corresponding ability. 

  • Lower shrinkage at Higher temperature enhance product stability.

 

SPECIFICATION & APPLICATION

Standard type:Applicable to wet and dry process, good for printed line width ≥ 80um

Product Name
Solid Content
Viscosity
10 rpm
Fineness
Volume resistivity
IP3190 90±1% 210±20Pa-s ≤15um <3E-6Ω·cm
IP3185 85±1% 210±20Pa-s ≤15um <3E-6Ω·cm
IP3180 80±1% 210±20Pa-s ≤15um <3E-6Ω·cm

 

Low Shrinkage type:Applicable to wet and dry process, good for silver coating thickness ≥ 30u

Product Name
Solid Content
Viscosity
10 rmp
Fineness
Volume resistivity
IP3190-AZ 90±1% 210±20Pa-s ≤15um <3E-6Ω·cm
IP3185-AZ 85±1% 150±20Pa-s ≤15um <3E-6Ω·cm
IP3180-AZ 80±1% 50±10Pa-s ≤15um <3E-6Ω·cm

 

For Fine Line type:Applicable to wet and dry process, good for printed circuit from 25 to 80um

Product Name
Solid Content
Viscosity
10 rmp
Fineness
Volume resistivity
Printed circuit range
IP3190 90±1% 210±20Pa-s ≤15um <3E-6Ω·cm 40~80um
IP3185 85±1% 210±20Pa-s ≤15um <3E-6Ω·cm 40~80um
IP3180 80±1% 210±20Pa-s ≤15um <3E-6Ω·cm 40~80um
IP1788 88±1% 400±20Pa-s ≤15um <3E-6Ω·cm 25~40um

 

  • 電性量測結果:電性維持度高

  • Fine line printability:diffusion rate <5%(40~80um)

  • Fine line printability:diffusion rate <5%(25~40um)

 

93%Ag line printing type:Reduce the Rdc of the inductor component to increase the Q value of the inductor to facilitate high-frequency applications and reduce the temperature rise of the magnetic beads to allow it to withstand large currents.

Product Name
Solid Content
Viscosity
10 rmp
Fineness
Volume resistivity
IP3193 93±1% 210±20Pa-s ≤15um <3E-6Ω·cm

 

The silver content is as high as 93%, and its printability is still excellent.

At the same printing condition, it can increase 30% thickness than 90% Ag inner paste. This feature can make more lower Rdc of MLCI.

Storage and Shelf Life

Store in a cool(temperature below than 25℃ is recommended), dry and well-ventilated area.

ABOUT

Ample Electronic Technology was established in June 2007. Armed with an exceptional management team and advanced production technologies, ample now manufactures high-quality thick-film conductive materials and focuses on their production and selling. ample never stops experimenting with new technologies and improving its manufacturing processes. ample also keeps fostering more reasonable management strategies to strive in a technology industry that is fast-changing and competitive.