Copper Conductive Paste and Resistive Paste for External Electrodes of Resistor

PRODUCT DESCRIPTION

Instead of using precious metal like traditional resistor, it use copper as conductive material and copper-nickel as resistive material, and it’s designed to replace low-resistance precious metal paste. Presently it can apply to components whose resistance is between 0.1 to 5 Ω, while the appearance after plating shows no difference to traditional type.

MAIN FEATURE

  • Printing paste.
  • Sinter under nitrogen atmosphere, sintering temperature is 900+/-20℃.
  • The conductive part is copper paste, and the resistive part is copper-nickel paste.
  • Good adhesion between paste and substrate after sintering.

SPECIFICATION & APPLICATION

Customized services are available

Item PC6920 RU00 RU01 RU03
Design resistance range ,Ω Top and back conductor 0.1 1 2~5
Inorganic content % 5-10 20~35
Cu / Ni content % 78-80 30~50
Viscosity
10rpm
(kPa*s)
55-75 55~75
Size range inch 0805-2520 0805-2520
Resistivity Ω‧cm 2.85E-06 8.0E-05 7.0E-04 3.0E-03
Ω/□;10um 2.85E-03 0.08±0.02 0.70±0.2 3.0±2
TCR
(25~155℃)
ppm/℃ - +/-200 +/-200 +/-200
Firing temp. at N2 900+/-20 910 910 910 910

 

 

PASS AND FAILURE MODES AFTER SINTERING

STORAGE

  • Store in a cool(temperature 5~25℃), dry and well-ventilated area.
  • Shelf life is 6 months.

HANDLING

  • Keep containers tightly sealed.
  • Keep away from heat and direct sunlight.
  • Ensure good ventilation / exhaustion at the workplace.
  • Avoid contact with skin and eyes.
  • Keep ignition sources away – Do not smoke.

ABOUT

Ample Electronic Technology was established in June 2007. Armed with an exceptional management team and advanced production technologies, ample now manufactures high-quality thick-film conductive materials and focuses on their production and selling. ample never stops experimenting with new technologies and improving its manufacturing processes. ample also keeps fostering more reasonable management strategies to strive in a technology industry that is fast-changing and competitive.