IC (SOT、QFN package)/LED Die Attach Silver Paste
Product advantage
- Excellent stability of operation, suitable for stamping and dispensing.
- Good adhesion stability.
Characteristic Table of Silver Paste
| Characteristic Item | unit | AI-8500 series | Test condition | ||
|
Viscosity
|
cps
|
8000
|
5rpm
|
||
|
T.I.
|
-
|
5.0~7.0
|
0.5rpm/5rpm
|
||
|
Volume Resistance
|
Ω·cm
|
<5x10-4
|
4-point probe
|
||
|
Water Extracted
|
Cl-
|
ppm
|
<30
|
Ionic Impurity measurement
|
|
|
Na+
|
|||||
|
K+
|
|||||
|
Mount strength
|
RT
|
MPa
|
>30
|
1x1mm Si die
L/F: Ag/Cu
|
|
|
260℃
|
>5
|
||||
|
RT
|
MPa
|
>50
|
0.2x0.2mm AsGa die
L/F: Ag
|
||
|
260℃
|
>10
|
||||
|
Weight Loss
|
300℃
|
%
|
<1
|
TGA
|
|
|
Moisture absorption
|
%
|
<1
|
85℃/85%/72hr
|
||
|
Thermal Conductivity
|
W/mK
|
2.0
|
Hot Disk
|
||
Workability
Adhesion
