Low Temp., High Thermal Conductivity Die Attach Paste
Applications
1.high power semiconductor.
2. Applicable to stencil printing.
Ex: IGBT (Insulated Gate Bipolar Transistor)
Product advantages
1.High thermal conductivity: >100 W/ mK
2.Sintered silver paste does not produce IMC (IMC, Intermetallic Compound), which improve the life cycle of high power semiconductor.
3.High Adhesion: Enhanced semiconductor and leadframe reliability(Ag or Au).
4.Pressureless and low temperature : It can be sintered at 230°C to reduce chip damage and improve process yield.
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Item
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Result
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| Filler content | 90±2% |
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Viscosity@5rpm
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30000±5000 Cps |
| Volume resistivity | <1×E-5 ohm-cm |
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Mount strength
(0.5x0.5mm Si die on Ag leadframe)
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>20 MPa(RT) |
| >10 MPa(260℃) | |
| CTE(Alpha 1) | 12 ppm/℃ |
| Elastic modulus | 10 GPa(RT) |
| Thermal Conductivity | >100W/mK (121℃) |