Low Temp., High Thermal Conductivity Die Attach Paste


1.high power semiconductor.
2. Applicable to stencil printing.
Ex: IGBT (Insulated Gate Bipolar Transistor)

Product advantages

1.High thermal conductivity: >100 W/ mK
2.Sintered silver paste does not produce IMC (IMC, Intermetallic Compound), which improve the life cycle of high power semiconductor.
3.High Adhesion: Enhanced semiconductor and leadframe reliability(Ag or Au).
4.Pressureless and low temperature : It can be sintered at 230°C to reduce chip damage and improve process yield.


Filler content 90±2%
30000±5000 Cps
Volume resistivity <1×E-5 ohm-cm
Mount strength
(0.5x0.5mm Si die on Ag leadframe)
>20 MPa(RT)
>10 MPa(260℃)
CTE(Alpha 1) 12 ppm/℃
Elastic modulus 10 GPa(RT)
Thermal Conductivity >100W/mK (121℃)



Ample Electronic Technology was established in June 2007. Armed with an exceptional management team and advanced production technologies, ample now manufactures high-quality thick-film conductive materials and focuses on their production and selling. ample never stops experimenting with new technologies and improving its manufacturing processes. ample also keeps fostering more reasonable management strategies to strive in a technology industry that is fast-changing and competitive.