Power IC/LED High Thermal Conductivity Die Attach Silver Paste
Product advantage
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Excellent stability of operation, suitable for stamping and dispensing.
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High thermal conductivity, high electrical conductivity, and good high temperature adhesion.
Characteristic Table of Silver Paste
| Characteristic Item | unit | AI-9000 series | Test condition | ||
| Viscosity | cps | 13000 | 5rpm | ||
| T.I. | - | 5.0~7.0 | 0.5rpm/5rpm | ||
| Volume Resistance | Ω·cm | 2x10-5 | 4-point probe | ||
| Water Extracted | Cl- | ppm | <30 | Ionic Impurity measurement | |
| Na+ | |||||
| K+ | |||||
| Mount strength | RT | MPa | >30 |
0.5x0.5mm
Si die L/F: Cu
|
|
| 260℃ | >15 | ||||
| CTE |
Alpha1/2
|
ppm/℃ | 18/82 | TMA | |
| Modulus | RT | MPa | 3.8 | DTMA | |
| Weight Loss | 300℃ | % | <1 | TGA | |
| Moisture absorption | % | <1 | 85℃/85%/72hr | ||
| Thermal Conductivity | W/mK | 20 | Hot Disk | ||
Workability
*AI-9000 series has good appearance.
Adhesion
