Power IC/LED High Thermal Conductivity Die Attach Silver Paste

Product advantage

  1. Excellent stability of operation, suitable for stamping and dispensing.
  2. High thermal conductivity, high electrical conductivity, and good high temperature adhesion.

Characteristic Table of Silver Paste

Characteristic Item unit AI-9000 series Test condition
Viscosity cps 13000 5rpm
T.I. - 5.0~7.0 0.5rpm/5rpm
Volume Resistance Ω·cm 2x10-5 4-point probe
Water Extracted Cl- ppm <30 Ionic Impurity measurement
Mount strength RT MPa >30
Si die L/F: Cu
260℃ >15
ppm/℃ 18/82 TMA
Modulus RT MPa 3.8 DTMA
Weight Loss 300℃ % <1 TGA
Moisture absorption % <1 85℃/85%/72hr
Thermal Conductivity W/mK 20 Hot Disk



*AI-9000 series has good appearance.



Ample Electronic Technology was established in June 2007. Armed with an exceptional management team and advanced production technologies, ample now manufactures high-quality thick-film conductive materials and focuses on their production and selling. ample never stops experimenting with new technologies and improving its manufacturing processes. ample also keeps fostering more reasonable management strategies to strive in a technology industry that is fast-changing and competitive.