TIM1-High Thermal Conductivity Material
Product Application:
TIM1 thermal material is applied in advanced packaging, providing innovative thermal dissipation solutions.
Product Advantages:
- Thermal conductivity>50W/m.k
- Modulus at room temperature< 3.0GPa
- Excellent adhesion
- Solvent-free system
Curing Conditions:
-
Ramp rate: 5°C/min from room temperature to 150°C → hold at 150°C for 30 minutes
-
Ramp rate: 5°C/min from 150°C to 200°C → hold at 200°C for 120 minutes
HTD series
|
Model
|
HTD series
|
| Viscosity(5 rpm) | 20,000 cps |
|
Thixotropic index
(0.5 / 5 rpm)
|
5.7 |
| Pot Life @25℃ | 24hr |
|
CTE 1
(α 1/α 2 , TMA)
|
20 / 40 ppm/℃ |
| Volume Resistivity | 1.0E-05 Ω．cm |
|
Modulus
(RT/260℃, DMA)
|
2.5 / 1.5 GPa |
|
Thermal conductivity
(Laser Flash)
|
> 50 W/mK |
|
Die shear strength
(Ni@Cu / 0.5*0.5mm)
|
>5kg |
 |
►Customizable |
 |
|
| ►No voids after curing | |